Alternative Materials For Hybrid Bonding

Key Takeaways: Hybrid bonding is essential for the interconnect density that high-bandwidth workloads require. Successful implementation depends on control of surface chemistry and surface topography — clean surfaces with topography that can accommodate expansion during bonding. To improve interface quality and manage stresses related to thermal expansion mismatch, manufacturers are considering alternatives to the “standard” copper/silicon dioxide bonding surface, including alternative dielectri