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pulse Semiconductor Engineering October 08, 2026

Demonstrating Plasma As A Viable Alternative To KOH For LCP Metallization Applications

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This blog examines the use of plasma technology as an alternative surface treatment method for liquid crystal polymer (LCP) materials. The study demonstrates how optimized plasma processing can achieve effective surface roughening and activation, providing a viable alternative to conventional KOH treatment while delivering the coverage and adhesion required for subsequent electroless copper plating. The challenge LCP is a high-performance engineering plastic widely used in the electronics, autom

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