TSMC and ASML announce initiative to pioneer industry transition to large-format photomasks for high NA EUV

and Taiwan Semiconductor Manufacturing Co. have announced a collaborative initiative to lead the semiconductor industry’s transition to a larger-format Extreme Ultraviolet (EUV) lithography photomask. While High NA EUV will be adopted for production using the current, 6-inch masks, the transition to larger, 12-inch masks is expected to further increase fab productivity, lower chipmaking costs and remove stitching constraints, benefiting the entire semiconductor industry.