Chip Industry Week in Review

SPIE News News from this week’s SPIE Photomask Technology + Extreme Ultraviolet Lithography conference : ASML and TSMC are launching an industry initiative to transition high-NA EUV lithography from current 6-inch photomasks to larger 12-inch masks , which could improve scanner productivity and eliminate some stitching constraints. The companies are targeting a 12-inch mask pilot line by 2031, with production-ready systems by 2033. TSMC plans to begin using high-NA EUV in high-volume manufacturi