Redefining Processes At Sub-2nm

Key Takeaways: Sub-2nm manufacturing is blurring traditional process boundaries as shrinking dimensions and tighter margins make test, metrology, inspection, and manufacturing increasingly interdependent. More sensitivity creates more noise. Advanced inspection can detect millions of potential defects, making it harder to distinguish harmless process variation from issues that affect yield, reliability, or performance. Data needs to flow back and forth across a chip’s entire lifecycle so it can