Research Bits: Sept. 8

Carbon insulating film for interconnects Researchers from the National University of Singapore developed an atom-thin film of amorphous carbon designed to insulate increasingly thin copper interconnect wires. The film maintained a dielectric constant of 1.35 across thicknesses from 0.8nm to 2.7nm, withstanding strong electric fields while preventing copper ions from passing through it. “Carbon can conduct electricity in many forms, so at first it may seem an unlikely choice for an insulator,” sa