Multi-Die Design for Automotive Applications

Electronics for automobiles sit in the middle of two key trends in the semiconductor industry. The first is the increasing need for functional safety in many applications, bolstered both by user demands and formal standards. Safety considerations affect many aspects of chip development, from technology choices to system implementation. The other key trend is the move toward multi-die designs where homogeneous dies (also called chiplets) or heterogeneous dies implemented in different process tech