Blog Review: Sept. 2

Cadence’s Udaya Shankar explores the major shifts shaping the transformation of modern semiconductor design, from transistor architecture evolution and manufacturing complexity to chiplet-based design , UCIe standardization, and high-bandwidth memory. In a podcast, Siemens’ Tova Levy chats with Sudarshan Deo about what AI can do in 3D-IC design today, such as narrowing design space exploration in chiplet partitioning and floor planning, identifying promising materials and process combinations, o