Chip Industry Technical Paper Roundup: Sep. 1

New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Thermal Tuning Overhead in Wafer-Scale Optical Interconnects for LLM MoE Training: A Cross-Layer Analysis and Ferroelectric-Based Mitigation Georgia Tech ROBBIN: Rowhammer-Based Backdoor Injection during Inference Northeastern University An Open-Source Benchmark Suite of 3D-IC Testcases UCLA Generative Design of Liquid-Cooling Channels for Thermal Management of 2.5D and 3D Integrate