ASIP Technologies Bets ₹25B on Advanced Chip Packaging, Targets 300M Units Capacity

Automation and human expertise are expected to play central roles in the new facility coming up near Visakhapatnam. ASIP Technologies has commenced work on its ₹25 billion semiconductor packaging and testing facility in Tarluvada, Visakhapatnam, following the virtual foundation stone laying by Prime Minister Narendra Modi. Being developed in two phases, the facility is planned […]