From Blueprint To Build: Engineering The World’s Largest AI Chips

By Sujit Sharan and Yang Guo Today’s most advanced AI systems rely on larger, more complex assemblies of dies and chiplets from multiple process nodes and foundries, driving unprecedented demands on advanced packaging. At the 2026 IEEE Electronic Components and Technology Conference (ECTC), two Intel Foundry research teams presented complementary approaches to meet this shift: one outlined an architectural blueprint for the next generation of AI chip packages, while the other tackled a key manuf