Tessolve collaborates with Intel Foundry to support EMIB-based advanced package design

Tessolve will support Intel Foundry customers globally by providing package design and simulation services Tessolve has announced a collaboration with Intel Foundry to support package designs based on Embedded Multi-die Interconnect Bridge (EMIB), Intel’s advanced packaging technology designed for heterogeneous multi-chiplet architectures. Under the collaboration, Tessolve will support Intel Foundry customers globally by providing package […]