Samsung and Broadcom sign an AI chip deal

Samsung Electronics recently entered into an agreement, valued at over $200 billion, with Broadcom to expand collaboration across memory chips, foundry and advanced packaging technologies through to 2030. The pair signed a memorandum of understanding at the AI Summit in San Francisco, with the South Korean vendor explaining the tie-up aims to deliver “integrated semiconductor solutions for the AI era”. Under the agreement, the partners will collaborate on high bandwidth memory (HBM) for Broadcom