Realizing The Future Of 3D-IC: Final Scenario And Sign-off

By Keith Felton and Todd Burkholder Multi-chiplet packages contain thousands of connections between chiplets, interposers, and package BGAs. After optimizing this complex connectivity, designers must identify related signal groups (interfaces or buses) and plan their path from the chiplet bump field to target bumps or BGA balls. This involves managing multiple groups, considering available routing real estate and channels, and ensuring that electrical performance meets expectations and that inte