Monolithic 3D-DRAM with Oxide-Semiconductor Architecture (imec, KU Leuven, Samsung, Lam)

Researchers from imec, KU Leuven, Samsung Electronics, and Lam Research published a technical paper titled “Optimization of 3D-DRAM Architecture with Oxide-Semiconductor Channel through Process and Device Simulation.” Abstract Excerpt: “We investigate a monolithically stackable OSC-based 3D-DRAM cell using an integrated framework combining process emulation, TCAD device simulation, parasitic extraction, and analytical modeling.” Find the technical paper here . July 2026. J. Hong et al., “Optimiz