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deep tech Tech-Economic Times July 16, 2026

Cadence rolls out AI agent to speed circuit board, chip packaging design

Cadence rolls out AI agent to speed circuit board, chip packaging design
AI Summary

The tool, called AuraStack, lets engineers describe their goals in plain language, then plans and carries out the work ‌using Cadence's ⁠existing ⁠software tools to lay out and virtually test circuit designs. Cadence said Nvidia ​chips will accelerate the AI work.

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