Materials shaping the future of advanced semiconductor packaging

As semiconductor packaging technologies evolve, 2.5D packaging and 3D Cu-Cu hybrid bonding are becoming essential routes to higher performance and improved power efficiency. However, manufacturing these packages at high yield requires careful material selection, process control, and continued innovation in packaging manufacturing techniques. IDTechEx's latest report, "Materials and Processing for Advanced Semiconductor Packaging 2027-2037: Technologies, Players, Forecasts," examines these challe