imec roadmap extends to A3 by 2038; Chip density gains shift beyond traditional transistor scaling

Leading semiconductor research institute imec has unveiled its latest process roadmap, signaling a major shift in the evolution of advanced chips. According to TechNews, citing Tom’s Hardware, the roadmap suggests that traditional transistor scaling will no longer be the sole driver of chip density as contacted poly pitch (CPP) approaches its practical limits. imec forecasts that semiconductor technology will advance to the A3 (0.3nm) generation by 2038.