ASML expects first high-NA EUV memory, logic products within months amid TSMC’s cost-driven delay

While TSMC revealed that its upcoming A13 and A12 processes, both targeted for 2029, are not expected to require High-NA EUV lithography, ASML says the first chips produced using the technology may arrive soon. According to Reuters, ASML CEO, Christophe Fouquet said the company expects to see the first memory and logic products manufactured on High-NA EUV systems within the next few months. As the report notes, TSMC said last month that high-NA EUV machines, which can cost up to US$400 million e