TSMC breaks ground on more advanced packaging fabs in Chiayi

TSMC will build additional advanced packaging fabs in the second phase of the Chiayi Science Park in southern Taiwan, National Science and Technology Council minister Wu Cheng-wen said at a groundbreaking ceremony on Sunday. Packaging is where the AI supply chain currently pinches, and it is the same constraint that Nvidia’s multi-year HBM4 deal with SK Hynix […] This story continues at The Next Web