TSMC can’t keep up with CoWoS demand, sending advanced packaging orders spilling over to Intel and rival Taiwanese fabs

TSMC is facing a surge in AI chip orders using its advanced packaging technology, such as CoWoS, but competitors such as Intel are benefiting as the Taiwanese semiconductor powerhouse is unable to keep up with demand. AI and HPC chip demand has reached an unprecedented level, and the chips that are being built are based on some of the most advanced packaging technologies that the world has ever seen. Leading this advanced packaging race is none other than TSMC, whose CoWoS (Chip-on-Wafer-on-Subs