ACM Research reports SPM wafer cleaning innovations

ACM Research has introduced Ultra C Tahoe advanced cleaning tool that meets the demanding technical requirements of advanced nodes for foundry, logic and memory applications. The tool delivers the performance of standalone single-wafer cleaning tools on low-to-medium temperature sulfuric peroxide mix (SPM) processes. Tahoe’s patented hybrid architecture is among the first in the industry to combine batch wafer processing and single wafer cleaning chambers into the same SPM tool.