Multi-die Testing In The Field Must Build On Established Test Methodologies

Key Takeaways: In-system testing is the very best way to ensure the longevity of data center and automotive hardware. A 2-die monitor, test, and repair strategy requires a modified test strategy and new physical-aware bump repair. Microbumps are too small to probe directly, so sacrificial pads enable probing. The AI revolution is significantly outpacing the IC industry’s ability to sufficiently test multi-chip systems for all necessary failure mechanisms at probe, final test, and system-level te