From Data Accumulation To Data Activation: AI-Driven Data Feed Forward For Chiplet-Based Test

For most of the industry’s history, the lever for semiconductor performance gains was process-node scaling. That is no longer the whole story. As one recent industry analysis put it, advanced packaging has now displaced node scaling as the primary lever for performance gains. The consequence reaches well beyond design and assembly; it lands squarely on test. In a monolithic world, test optimization was hard but bounded: a single integrated die was validated, and the data and decision boundaries