IICIE, CIOE, and elexcon 2026: Uniting optics, chips, and storage to power full AI computing ecosystem

As large AI models and 100,000-card computing clusters rapidly accelerate, industry development has transcended the independent evolution of optics, storage, electricity, and chips. Optical interconnects form the core framework for efficient computing cluster communication. Integrated circuit manufacturing and advanced packaging lay the process foundation for silicon photonics and co-packaged optics (CPO).