Observability Is A Missing Layer In AI-Era Chiplet Design

Key Takeaways: In chiplet-based architectures, observability must be designed as a fabric-aligned, cross-die telemetry plane so architects can correlate traffic, latency, congestion, and fault behavior across package boundaries without losing system context. AI can extract value from high-volume silicon telemetry only when the architecture provides consistent instrumentation, near-sensor reduction, programmable collection, and software-accessible data models that scale from on-die monitors to fl