Leaked A20 Pro Image Hints at iPhone 18 Pro Performance Gains

An alleged image of the iPhone 18 Pro motherboard has leaked online, showing the A20 Pro chip will use a new packaging technology that should offer notable performance gains over the previous model. The leaked image, which has been shared by the accounts " WHYLAB " and " Ice Universe " on Weibo, appears to show the A20 Pro chip integrated into TSMC's new packaging architecture, known as Wafer-Level Multi-Chip Module (WMCM) technology. Traditionally, Apple has used package-on-package (PoP) design