TSMC preparing for full-scale mass production of PLP semiconductors

TSMC is set to go head-to-head with Samsung Electronics using "panel-level packaging (PLP)," a next-generation semiconductor packaging technology. PLP can significantly improve the productivity of AI chip manufacturing, and with TSMC hurrying to ready mass production, a contest for leadership with Samsung Electronics—which entered the market first—looks inevitable. According to industry sources, TSMC is building out a materials, components, and equipment (MCE) supply chain to establish its PLP m