As HBM fever intensified, SK Hynix took steps to cool down.

Korean semiconductor company SK Hynix has unveiled a new high-bandwidth memory (HBM) for AI data centers that improves heat dissipation performance by integrating a cooling layer inside the memory package. This technology is expected to help increase the operation speed of AI processors equipped with this memory or reduce cooling costs. Most existing semiconductor cooling structures dissipate heat from the outside of the package.