AMD commits more than $10bn to Taiwan’s AI ecosystem with ASE, SPIL and Helios as the visible deliverables

Lisa Su’s Taiwan announcement covers advanced silicon, packaging and manufacturing partnerships for the company’s rack-scale Helios platform, set for deployment in the second half of 2026. AMD announced on Wednesday more than $10bn of investments across Taiwan’s semiconductor ecosystem to expand strategic partnerships and scale advanced packaging manufacturing for next-generation AI infrastructure. The commitment covers a multi-year […] This story continues at The Next Web