TSMC plans 1nm chip roadmap and up to 12 new fabs

The semiconductor race in advanced process technology is accelerating. As the first batch of 2nm chips is expected to enter production later this year, TSMC is already looking further ahead and has reportedly begun planning for 1nm process development. To prepare for future demand and long-term technology upgrades, the company is also building up to 12 new wafer fabs, which will serve as key production bases for nodes ranging from 2nm to 1.4nm.