Is It Getting Hot In Here? Why Thermal Is No Longer A Signoff Problem

AI, high-performance computing and advanced semiconductor packaging have pushed power density higher, and that means managing heat is becoming one of the most consequential challenges in electronic design. The issue is no longer simply how to cool a chip after it has been designed. Thermal behavior now affects decisions spanning device performance, package architecture, mechanical stress, reliability, floor planning and ultimately system performance. So engineering teams must shift thermal analy