Chip Industry Technical Paper Roundup: Oct. 27

New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Beyond HBM-on-GPU: Thermal Design Envelope for 3D Volumetric DRAM-on-GPU Integration imec Self-Heating and Parasitic Effects in Multi-Tier CFET Design TU Munich , IIT Kanpur Reduced-DSP 200G/λ Low-Voltage Slow-Light Silicon Modulator Enabled by Built-In EO Equalizer Institute of Science Tokyo , Yokohama National University , AIST , PETRA Irradiation-Source-Dependent Tone Conversion