Vertical DRAM Stacking Expands Thermal Design Space Beyond HBM-on-GPU (imec)

Researchers at imec published “Beyond HBM-on-GPU: Thermal Design Envelope for 3D Volumetric DRAM-on-GPU Integration.” Summary : Researchers evaluated a 3D memory architecture that rotates DRAM dies vertically above a GPU and places cooling cavities between them as an alternative to conventional 2.5D HBM and direct-stacked HBM-on-GPU. Package-level thermal simulations examined stack height, memory capacity and organization, cooling-cavity materials, stack orientation, mold insertion, and the addi