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pulse Semiconductor Engineering October 22, 2026

Foundries And OSATs Increasingly Overlap

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Key Takeaways: Foundries have been doing backend work for advanced packages. OSATs are now taking that on. This particularly affects 2.5D and panel assembly with new equipment and materials. Hybrid bonding is mostly a foundry activity now but will likely move to OSATs as well. Foundries and outsourced assembly and test (OSAT) houses have traditionally had distinct lanes, but the lines are blurring as OSATs acquire select foundry capabilities and foundries return some of the jobs they have taken

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