A Composable Thermal Solver For Heterogeneous 2.5D/3D-IC Packages (Cadence, Notre Dame)

Researchers at Cadence Design Systems and the University of Notre Dame published “A Composable AI-Accelerated Iterative Solver for 3D-IC Thermal Modeling.” Abstract : “Accurate thermal analysis of heterogeneous 2.5D/3D-IC packages is essential yet computationally prohibitive. A single full-package FEM simulation can take hours, while AI-based surrogates treat the entire stack as a monolithic prediction target and must be retrained whenever the die count or topology changes. To address this limit