Thermal Co-Simulation Testing Of Co-Packaged Optics

By Vladimir Stojanovic and Igor Elkanovich The CPO revolution is at our doorstep. But transforming data center interconnects requires overcoming new challenges in architecture, power delivery, mechanical design, and thermal management. Of these, thermal management has emerged as one of the most critical areas for successfully deploying co-packaged optics (CPO) in hyperscale AI environments. Thermal instability has been a concern for CPO technology. Ayar Labs and Global Unichip Corp. (GUC) jointl