GlobalFoundries reaches agreement to establish U.S.-based supply of silicon interposers for advanced AI packaging

GlobalFoundries announced a manufacturing agreement with TSMC to establish a U.S.-based supply of silicon interposers for TSMC’s CoWoS advanced packaging ecosystem. Under the agreement, GF will provide manufacturing service to TSMC, and add fabrication capacity at its Malta, New York facility, supporting growing demand for high-performance computing and AI systems. The agreement provides a foundation to expand capacity over time as customer demand grows.