Innolux’s deployment of key FOPLP technologies: Leading next-gen advanced packaging and seizing AI opportunities

Driven by the rapid growth of AI, high-performance computing (HPC), and automotive electronics, chips are evolving toward high performance, chiplet designs, and heterogeneous integration architectures, fueling continuous demand for advanced packaging. According to Counterpoint Research, the global market size for Fan-Out Panel-Level Packaging (FOPLP) and glass substrates packaging is expected to grow from approximately US$650 million in 2024 to over US$8 billion in 2030.