RRP Electronics Opens Advanced Wafer-Level Packaging Facility in Navi Mumbai

The new facility expands the company’s OSAT capabilities, with a focus on SIM modules, eSIMs and specialised semiconductor packaging. RRP Electronics Ltd has inaugurated an Advanced Wafer-Level Packaging (AWLP) facility at its semiconductor manufacturing unit in Navi Mumbai, Maharashtra. The expansion strengthens the company’s capabilities in advanced packaging, connectivity modules and specialised semiconductor applications.