Why Heat Is Becoming A Bigger Chip Design Issue

Key Takeaways: Complex designs now require voltage, timing, resistance, power, and temperature to be analyzed together, and in the context of each other. Vertical scaling will require new materials and cooling options. Agentic AI could help engineers cross traditional discipline silos, which will be necessary because thermal is a system-level problem. Experts at the Table : Semiconductor Engineering sat down to discuss the growing thermal challenges and trade-offs as dies are stacked, vertically