Accelerating Advanced IC Package Design: A Methodology for Early and Iterative Optimization of Chiplet Integration

Today’s multi-chip and chiplet solutions are leading the way for the “More than Moore” vision, with companies leveraging packaging technologies to create value and differentiate themselves from their competitors. Through-silicon via (TSV), wafer-level packaging (WLP), and 3D stacking technologies offer a wide range of packaging options for all form factors. Figure 1 illustrates a common example of 3D die/wafer stacking vs the traditional 2D system-on-a-chip (SoC). Fig. 1: Common example for 3D d