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deep tech Semiconductor Engineering October 12, 2026

Carbon-Dot Interface Enables Ultrathin High-κ Dielectrics on 2D Semiconductors (UIUC, NETL, Argonne, Monash)

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Researchers at the University of Illinois Urbana-Champaign, National Energy Technology Laboratory, Argonne National Laboratory , and Monash University published a technical paper titled “Integration of high-κ oxide on 2D semiconductors with carbon-dot monolayer assembly as van der Waals interfacial layer.” Abstract Excerpt: “This atomically thin assembly forms a van der Waals interfacial layer that enables deposition of ultrathin high-κ oxides.” Find the technical paper here . October 2026. Wong

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