Tata Electronics, Besi Partner to Develop Advanced Semiconductor Packaging in India

The partnership aligns with India’s efforts to establish a domestic outsourced semiconductor assembly and test (OSAT) industry Tata Electronics and Dutch semiconductor assembly equipment supplier Besi have signed a memorandum of understanding (MoU) to develop advanced semiconductor packaging capabilities in India. The partnership will support Tata Electronics’ planned $3 billion semiconductor packaging facility in Jagiroad, […]