GlobalFoundries and TSMC Partner on US Interposer Production for CoWoS

Five-year agreement expands Malta, New York fab to create domestic supply chain for high-performance AI chips. GlobalFoundries (GF) has reached an agreement with TSMC to supply silicon interposers for TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging ecosystem from a US manufacturing base. Under the initial five-year contract, GF will act as a foundry partner to TSMC, adding […]