Applied Materials and Besi expand strategic partnership to advance next-gen packaging for AI scaling

and BE Semiconductor Industries N.V. (Besi) have announced an expansion of their longstanding strategic partnership, with Besi joining Applied's EPIC Center as an Innovation Partner. The collaboration builds on the companies’ joint development program launched in 2020, and extends co-innovation beyond hybrid bonding into new interconnect architectures and applications supporting the semiconductor industry's AI-driven scaling roadmap.