Applied Materials and Intel Collaborate to Accelerate Chipmaking Innovations for AI-Driven Computing

the leader in materials engineering for the semiconductor industry, today announced it is working with Intel Corporation (Nasdaq: INTC) to accelerate development of chipmaking innovations for next-generation transistors, interconnects and advanced packaging technologies. The collaboration will bring together cutting-edge capabilities from Applied’s EPIC Center in Silicon Valley and Intel’s R&D campus in Hillsboro, Oregon to shorten time-to-market of advanced semiconductor