From Process Learning To Production Control: Trends In Advanced Packaging And Implications To Characterization And Test

The explosive growth of heterogeneous integration, from 2.5D interposers and CoWoS to hybrid bonding and 3D stacking, is redefining what it means to “ramp a process.” Advanced packaging technologies exhibit yield sensitivities and defect mechanisms fundamentally different from front-end logic or standard packaging technology, yet the industry has lacked purpose-built metrology, characterization, and analytics frameworks to address these new challenges at scale. This presentation explains an inte