Finding Critical Defects Before They Become Costly Failures: Process Control For Hybrid Bonding And Advanced Packaging

In advanced packaging, value accumulates layer by layer, component by component, and process step by process step. By the time chiplets, high-bandwidth memory stacks, or hybrid-bonded devices reach assembly, manufacturers have invested substantial material and processing resources in those devices. An undetected defect at this stage can place the larger assembly at risk. Compounding this challenge, shrinking package features are bringing advanced packaging requirements closer to the tolerances h