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deep tech Semiconductor Engineering October 07, 2026

Blog Review: Oct. 7

AI Summary

Siemens’ Karen Chow, Sheetal Veronica, and Kunjesh Agashiwala explore how CFETs and buried power rails come together to reduce the chip area needed, improve power efficiency, and help meet the high-performance needs of AI accelerators, data centers and mobile processors. Synopsys’ Thomas Andersen says the strongest results come when agentic AI can leverage the company-specific knowledge that makes each engineering organization distinct, such as its methodologies, design history, priorities, best

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